1. Product usage:

This device is used in selective tape for various PCB board gold fingers, pads and other similar products. The equipment completes fully automatic processes such as automatic loading, camera alignment, automatic glue pasting, and automatic material collection. The glue position and length can be set through the program. The equipment has functions such as material shortage alarm, glue shortage alarm, material collection alarm, etc., and can be connected to the MES system according to customer needs.

2. Product features:

1) Products of the same specifications are produced at one time, and they are called directly next time. The replacement time is short and the operation is simple and fast.

2) The equipment can achieve horizontal, vertical and angle glue patching through program settings. The glue patching method is flexible and has a wide range of applications.

3) The equipment comes with two adhesive tapes, which can be applied to two different specifications of adhesive tapes at the same time.

4) The equipment can automatically adapt to different thicknesses of products with a wide range of 0.3mmmm plate thickness

5) Data import can be generated by camera and imported image files, which is easy to use and easy to operate.

6) The equipment uses front loading and unloading, covering a small area, making it easy to operate

3. Technical parameters: